TEKTRONIX INNOVATION FORUM: Engineering the Future

We are excited to invite you to our event of the year, 2021 Tektronix Innovation Forum

Dear Customers

We are excited to invite you to our event of the year, 2021 Tektronix Innovation Forum!

There are over 40 virtual sessions on the latest technology trends. Engage with Tektronix and Industry’s leading Experts in multiple virtual format, including presentations, panel discussions and technical demonstrations.

Here are some of the exciting highlights.

From Engineer to Astronaut:

An Inspiring Journey

Daniel Tani, a former NASA Astronaut and Engineer, will kickstart the event as our Keynote Speaker.

His lessons of global teamwork and overcoming surprise challenges while traveling 17,500 miles per hour will definitely inspire you, as a problem-solving engineer. Strengthening your work and teams for many years to come.

To the Future, From the Inside

Engineering is a story of solutions generated, and problems solved.

Moderated by Evaluation Engineering Editor, Alix Paultre, join this group of brilliant minds in a conversation that will cover the future of engineering, and where their curiosity is leading them right now.

Discover the endless possibilities in engineering today!

Stay Abreast of Key Trends in Technology

Keeping up with the technology trends is crucial and we are sure you will find these topics interesting:

>> Wide Bandgap Semiconductor Applications and Validation

>> Beamformer Frontends and Up-Down Converter ICs for mmWave 5G Infrastructure

>> PAM4 Optical Transceiver Characterization

>> Diagnosing Jitter Caused by Power Integrity Problems

>> Next-Gen Serial Bus Testing for Computing and Automotive Applications

>> And more...

This virtual event will bring ideas together, across different countries and culture, Engineering the Future together. Register FREE Now!

ຂ່າວທີ່ກ່ຽວຂ້ອງ

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What Is Resonant Frequency? Why Can a Single Frequency Range Damage the Entire Product?

A device may operate stably for months, yet suffer cracks, broken solder joints, or snapped component leads after being transported. What surprises many engineers is that the vibration amplitude during transport is no greater than usual. The root cause lies in a specific frequency range where the product's structure absorbs energy most intensely, triggering resonance and causing continuous stress concentration at a single point.

10/07/y 10:38:40

Should Carton Packaging Undergo Vibration Testing or Drop Testing First?

Một kiện hàng gần như không bao giờ bị rơi ngay khi vừa rời khỏi nhà máy. Quãng đường hàng trăm kilomet trên xe tải, container hay băng chuyền mới là giai đoạn diễn ra đầu tiên, nơi bao bì liên tục chịu rung lắc trong nhiều giờ. Chỉ sau đó mới đến những cú va chạm khi bốc xếp, giao nhận hoặc rơi ngoài ý muốn.

09/07/y 14:40:30

Distinguishing Between DFT and WFT in Coating Thickness Measurement

Many projects encounter a situation where a freshly applied coating looks perfectly uniform and paint consumption matches the estimate, yet additional coating is required during inspection because the thickness is insufficient. This leads many to suspect measurement errors or equipment inaccuracy, whereas the actual cause is a confusion between WFT (Wet Film Thickness) and DFT (Dry Film Thickness)

08/07/y 16:56:01

Can a car paint thickness gauge detect if a vehicle has been in a collision?

Many used car buyers often spend a considerable amount of time examining the paintwork, the gaps between body panels, or the overall condition of the exterior. However, these signs can be skillfully masked following repairs; precise color matching and careful polishing can make the vehicle appear almost factory-original.