GSI Technology GS882Z18CGB-200I SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 6.5ns/3ns 119-Pin F-BGA Tray
Density: 9 Mbit
Package: 119F-BGA
Mounting: Surface Mount
Rad Hard: No
MSL Level: MSL 3 - 168 hours
Pin Count: 119
SRAM Type: Synchronous NBT SRAM
Lead Finish: Tin-Silver-Copper
No. of Pins: 119
Timing Type: Synchronous
Architecture: Flow-Through|Pipelined
Memory Density: 9 Mbit
Number of Ports: 2
Number of Words: 512 kWords
Screening Level: Industrial
Supplier Package: FBGA
Address Bus Width: 18 Bit
Product Dimensions: 22 x 14 x 1.07 mm
Supply Voltage Max: 2.7, 3.6 V
Supply Voltage Min: 2.3, 3 V
Supply Voltage Nom: 2.5, 3.3 V
Clock Frequency Max: 200 MHz
Max Processing Temp: 260
Number of I/O Lines: 18 Bit
Operating Temperature: -40 to 85 °C
Data Rate Architecture: SDR
Number of Bits per Word: 18 Bit
Maximum Operating Current: 150@Flow-Through|175@Pipelined mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 6.5@Flow-Through|3@Pipelined ns
Maximum Operating Supply Voltage: 2.7, 3.6 V
Minimum Operating Supply Voltage: 2.3, 3 V
Typical Operating Supply Voltage: 2.5, 3.3 V
ຮັບສ່ວນຫຼຸດພິເສດຕາມປະລິມານ, ອັບເດດລາຄາຂາຍສົ່ງ ແລະ ການແຈ້ງເຕືອນສິນຄ້າໃໝ່ສົ່ງກົງເຖິງອິນບັອກຂອງທ່ານ.
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ເຂົ້າເຖິງຜູ້ຊ່ຽວຊານທີ່ໄດ້ຮັບການຢັ້ງຢືນຂອງພວກເຮົາໂດຍກົງ